LASER HEAT TREATMENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a laser processing device capable of performing processing by laser beam to a workpiece formed of a material having wide width and shape.SOLUTION: A laser processing device 100 is configured so that two sets of laser emission unit groups 114 in which four laser emission units 110 are disposed along an X-axis direction in the figure are disposed in parallel in a Y-axis direction in the figure. The respective four laser beam emission units 110 forming two sets of laser emission unit groups 114 are supported by a support unit 115 for supporting positions of light spots SP formed on a surface of a workpiece WK in a state that capable of being changed in the X-axis direction in the figure. A table 101 for supporting the workpiece WK is supported by a feeding device 102 in a state that the table can be displaced to the X-axis direction in the figure. The laser processing device 100 makes the table 101 displace in the X-axis direction in the figure in a state that the laser beam L is emitted from the respective laser emission units 110 for sequentially radiating the four light spots SP on portions which are processing targets.