LOW DENSITY POLISHING PAD

摘要

Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body (222) having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material (220). A plurality of closed cell pores (214, 218) is dispersed in the thermoset polyurethane material (220).