| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive pattern member for a substrate for a power module which obtains strong adhesiveness between a ceramic substrate and a conductive pattern layer and improves assembly workability. <P>SOLUTION: A conductive pattern member 10 is formed by tentatively fixing a conductive pattern layer 6 to a brazing material foil 9 in the lamination state. Multiple welded portions 12, formed by welding the brazing material foil 9 on a surface of the conductive pattern layer 6, are provided so as to be located along at least two facing sides of an outer periphery of the conductive pattern layer 6 or located at end parts of the two sides. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
