| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of intensively giving bonding energy to predetermined regions of a substrate and an object to be bonded when the object to be bonded is bonded to a predetermined position of the substrate.SOLUTION: When a substrate 23 is bonded to a predetermined position of a substrate 24 held by a stage 10, bonding energy consisting of ultrasonic vibration is given from an action surface 40a of an action part 40 to the substrate 24 and a predetermined region A of another substrate 23 superposed on the predetermined position of the substrate 24. However, bonding energy can be intensively given to the predetermined regions A of both substrates 23 and 24 because bonding energy transfer from the action part 40 to the peripheries of the predetermined regions A is blocked by a transfer blocking part consisting of a holding mechanism 50. |
