| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a prober capable of improving throughput by suppressing an increase in an installation area and an increase in device cost while keeping accuracy of a movement position of an alignment device shared by each measuring unit, and a probe inspection method.SOLUTION: A prober comprises: a plurality of measuring units 14 including a probe card 18 electrically connected to a test head 22; a wafer chuck 16 holding a wafer W in which a plurality of chips are formed; an alignment device 50 which performs relative alignment between the wafer W held on the wafer chuck 16 and the probe card 18; a moving device 100 which mutually moves the alignment device 50 between the measuring units 14; and a positioning and fixing device which is provided per measuring unit 14, and positions and fixes the alignment device 50 moved to each measuring unit 14.</p> |
