发明名称 THIN FILM BATTERY SUBSTRATE CUTTING AND FABRICATION PROCESS
摘要 <p>A method of fabricating a battery comprises selecting a battery substrate having cleavage planes, and cutting the battery substrate with pulsed laser bursts from a pulsed laser beam to control or limit fracture along the cleavage planes. The pulsed laser beam was also found to work well on thin substrates which are sized less than 100 microns. Before or after the cutting step, a plurality of battery component films can be deposited on the battery substrate. The battery component films include at least a pair of electrodes about an electrolyte which cooperate to form a battery.</p>
申请公布号 KR101489753(B1) 申请公布日期 2015.02.04
申请号 KR20070121336 申请日期 2007.11.27
申请人 发明人
分类号 H01M10/052;H01M10/0562;H01M10/0585;H01M10/36 主分类号 H01M10/052
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