| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device of finishing the both-plane-face, for continuously applicable for polishing work ranging from rough polishing to precise finish polishing, and for attaining even machining of entire workpiece without causing uneven wear of a polishing pad even when polishing time becomes long. <P>SOLUTION: In the device of finishing the both-plane-face, a polishing pad 2 is mounted on the lower face to form an upper surface plate 1 and a polishing pad 2 is mounted on the upper face to form a lower surface plate 4. Eccentric turning motion of the surface plates 1, 4 is enabled while opposing the polishing pads 2, 2 to each other. A carrier 3 performs sliding reciprocating motion in one-axis or two-axis directions, or performs circular track motion while automatically turning at low speed. A plurality of workpiece 9 are held on the carrier 3, slurry 3 to which abrasive grains are dispersed is supplied to a machining face from each of the surface plates 1, 4, and eccentric turning motion is given to each of the surface plates 1, 4 while repeatedly applying waveforms with preferable onset at low frequency in the plus range to which water in the slurry senses, thus making the carrier 3 slide in reciprocating motion or circular track motion while automatically turning. <P>COPYRIGHT: (C)2011,JPO&INPIT |
