发明名称 半導体装置及びその製造方法
摘要 According to one embodiment, a semiconductor device, includes: a first semiconductor region of a first conductivity type; a second semiconductor region provided on the first semiconductor region, an impurity concentration of the second semiconductor region being lower than an impurity concentration of the first semiconductor region; a third semiconductor region of a second conductivity type provided on the second semiconductor region; and a fourth semiconductor region provided on the third semiconductor region or in a portion of the third semiconductor region. A lattice strain of the fourth semiconductor region is greater than a lattice strain of the third semiconductor region.
申请公布号 JP5665912(B2) 申请公布日期 2015.02.04
申请号 JP20130098662 申请日期 2013.05.08
申请人 株式会社東芝 发明人 太田 千春;西尾 譲司;高尾 和人;四戸 孝
分类号 H01L29/861;H01L21/20;H01L21/265;H01L21/329;H01L21/336;H01L29/06;H01L29/12;H01L29/16;H01L29/47;H01L29/739;H01L29/78;H01L29/868;H01L29/872 主分类号 H01L29/861
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