| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electric power conversion system capable of enhancing cooling performance with a simple configuration. <P>SOLUTION: An electric power conversion system 1 includes a laminated semiconductor module 2. The semiconductor module 2 includes: a semiconductor molding part 20 having a semiconductor device, a heat sink 22, and an encapsulation part 23; a wall part 24; and a penetration coolant channel 41. The semiconductor molding part 20 is disposed with a power terminal 251 and a control terminal 261 to be projected in the direction orthogonal to the normal direction X. The semiconductor module 2 disposed at the both ends in the laminated direction includes a lid part 3. A creepage coolant channel communicating to the penetration coolant channel 41 and disposed along a heat radiation surface 221 is formed inside the wall part 24 which is located between adjacent semiconductor modules 2, and between the lid part 3 and the semiconductor module 2. The penetration coolant channel 41 is disposed in the direction where the power terminal 251 and the control terminal 261 are projecting with regard to the semiconductor molding part 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
