| 摘要 |
<p>According to the present invention, there are provided an electronic-component mounting structure and an electronic-component mounting method, in each of which solder mounting can be performed, and solder rise is not likely to occur. The electronic-component mounting structure includes an electronic component which has a metal substrate, a semiconductor ceramic layer formed on the metal substrate, a pair of split electrodes formed on the semiconductor ceramic layer, and plating films formed on the split electrodes and the metal substrate; and a mounting body on which lands to be connected to the respective split electrodes of the electronic component are formed. The position of a peripheral end portion of each land to be connected to the corresponding split electrode is located inside than the position of a peripheral end portion of the split electrode. In addition, a plane area of the land is smaller than that of the split electrode.</p> |
