| 摘要 |
<p>A manufacturing apparatus for a semiconductor device, comprising: a reactor chamber configured to load a wafer therein; a gas supplying mechanism configured to supply a process gas into the reactor chamber; a gas discharging mechanism configured to discharge a gas from the reactor chamber; a wafer supporting member configured to mount the wafer thereon; a ring configured to mount the wafer supporting member thereon; a rotary drive controlling mechanism configured to connect to the ring for rotating the wafer; a heater arranged in the ring for heating the wafer to a predetermined temperature; an electrode part configured to connect to the heater and including a screw concave portion; and an electrode including a screw portion which is connected to the electrode part via the screw concave portion.</p> |
