发明名称 CURABLE RESIN COMPOSITION AND PRIMER COMPOSITION
摘要 [Problem] Polyphenylenesulfide (PPS), polypropylene (PP), polyethylene (PE), stainless steel (SUS) and the like correspond to hard-to-bond materials, and thus it has been difficult to improve the adhesion to these materials in adhesives and sealants. [Solution] Provided is a curable resin composition containing: component (A), being a thermosetting resin composition; and component (B), being an adhesion-imparting agent consisting of a compound represented by the following general formula 1, or, containing the compound represented by the following general formula 1 and a compound represented by the following general formula 2: wherein in the general formula 1, n represents 0 to 2, R each independently represents an alkyl group having 1 to 10 carbon numbers or a derivative of the alkyl group, R' represents methyl group, ethyl group or propyl group, and in the general formula 2, m represents 1 to 3, and R 1 represents hydrogen atom or methyl group.
申请公布号 KR20150013174(A) 申请公布日期 2015.02.04
申请号 KR20147032303 申请日期 2013.05.15
申请人 发明人
分类号 C08K5/1515;C08K5/5425;C08L23/22;C08L101/00;C09D5/00;C09D7/12;C09D123/22;C09D201/00;C09J5/02;C09J11/06;C09J123/22 主分类号 C08K5/1515
代理机构 代理人
主权项
地址