| 摘要 |
<p>PURPOSE: A system and a method for treating a substrate are provided to maintain uniformly the thickness of patterns which are formed on a plurality of substrates by adjusting the deposition thickness of a subsequent step according to the deposition thickness of a previous step. CONSTITUTION: A first treatment device(100) forms a first thin film pattern on a substrate by a first treatment process. An inspection device(200) inspects the first thin film pattern on the substrate. A second treatment device(300) forms a second thin film on the substrate on which the first thin film pattern is formed by a second treatment process. A control part(400) analyzes the inspection result of the inspection device. A control signal which varies the condition of the second treatment process is applied to the second treatment device.</p> |
