发明名称 sputtering system and the fabrication method using the same
摘要 Disclosed are a sputtering system and a fabrication method of a display device using the same. The present invention comprises: a chamber; a plurality of targets installed in the chamber and arranged to face each other; a magnet unit placed inside each of the targets to form a magnetic field between the targets; a substrate wherein a film forming particle sputtered from the target is deposited; and a substrate holder supporting the substrate. As each target is installed with each magnet unit wherein two columns of magnets are arranged, the present invention is equipped with the targets wherein an electric loop is formed to become a half in each thereof. Therefore, the present invention can minimize abnormal discharge such as unbalanced corrosion of the target, density reduction of an arc and a plasma, and the like.
申请公布号 KR20150012585(A) 申请公布日期 2015.02.04
申请号 KR20130088268 申请日期 2013.07.25
申请人 发明人
分类号 C23C14/34;H01L51/56 主分类号 C23C14/34
代理机构 代理人
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