| 摘要 |
Provided is a resin composition for forming a solder bump which has superior soldering characteristic without deteriorating the removal characteristic of resist (dry film, etc) even when a substrate is exposed at high temperatures in a reflow or a baking process. The resin composition for forming a solder bump includes: (A) an alkali developing thermoplastic resin having acid value (mgKOH/g) of 110 or more (here, unsaturated fatty acid copolymer has an acid value of 80 or more); (B) a solvent; and (C) solder powder. Also, the resin composition excludes and activator. |
