| 摘要 |
<p>Provided are: a low cost resin paste composition that is suitably used for adhering conductor elements such as semiconductor chips and the like to a supporting member such as a lead frame or the like, that reduces the usage of silver which is a high cost material with high scarcity value, and that has excellent electrical conductivity, thermal conductivity, and adhesion, as well as excellent coating workability and mechanical properties; and a semiconductor device using the resin paste composition.</p> |
