PROCEDE DE FABRICATION DE CIRCUITS

摘要

A substrate for a micro-electronic circuit is pierced at select locations thereof, as by a laser beam or an ultrasonic drill and then mounted for rotation about a pair of axes defining an angle therebetween within a vacuum metal vaporization apparatus. A metal, such as gold, is vaporized within the apparatus and is uniformly deposited on the through-hole walls. Galvanic reinforcement of the metal coating on the through-hole walls takes place simultaneously with deposition of select circuit paths.