| 摘要 |
The present invention provides a circuit connecting material, an adhesive composition and an adhesive sheet allowing the manufacture of a circuit connecting structure that has enough adhesive strength and has excellent connection reliability even under conditions of high temperature and high humidity. The adhesive composition of the present invention includes a radical polymerizable substance and a radical polymerization initiator. The adhesive composition includes, as a radical polymerizable substance, a first radical polymerizable substance represented by chemical formula (1) and a second radical polymerizable substance having two or more (meth)acryloyl groups in addition to the first radical polymerizable substance; and dilauroyl peroxide as a radical polymerization initiator. In chemical formula (1), X1 and X2 may be identical or different and represent an acryloyl group, a methacryloyl group or a hydrogen atom; at least one among X1 and X2 represents an acryloyl group or a methacryloyl group; and n represents an integer from 8 to 15. |
