| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a communication module that can be miniaturized even though it comprises an antenna as well as a SIM card socket. <P>SOLUTION: A communication module includes: a multilayer wiring board having an antenna pattern; a SIM card socket mounted on the multilayer wiring board via a terminal for surface mounting; a semiconductor component mounted on the multilayer wiring board and comprising an authentication function unit and a communication processing circuit; an external connection part provided on the multilayer wiring board and comprising an input terminal for supplying power to the semiconductor component; a component for antenna matching circuit mounted on the multilayer wiring board and electrically connected to the semiconductor component and the antenna pattern by a wiring pattern; and an electric connection cut-off mechanism which comprises an electric conductive contact moved by push-down and electrically connected with the semiconductor component, and which is provided on the multilayer wiring board, and which is configured to disconnect electric connection between the semiconductor component and the antenna pattern when the contact is pushed down. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
