| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form strong joining between substrates. <P>SOLUTION: A method of manufacturing an electronic apparatus includes: a step of adhering a first substrate and a second substrate via a metallic paste containing metal particles and organic solvent; a step of forming an aggregate of the metal particles by removing the organic solvent from the metallic paste; a step of reducing surfaces of the metal particles constituting the aggregate using reductive gas; and a step of joining the first substrate and the second substrate using the aggregate by pressing the first substrate and the second substrate after a step of reducing the surfaces of the metal particles constituting the aggregate. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
