| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition which does not cause adhered interface peeling and package crack, even when exposed on severe reflow conditions, and can achive high package reliability, in a semiconductor device in which thinned semiconductor chips are laminated in many layers and in a high density. <P>SOLUTION: The adhesive composition comprises an acrylic polymer (A), an epoxy resin (B), and a curing agent (C) having a melting point or softening point of≥130°C, and has an exothermic reaction peak temperature of≥220°C and a calorific value of≤32 J/g, on DSC measurement, when heated at a temperature-rising rate of 10°C/min in a measurement range of 50-300°C in normal pressure. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
