| 摘要 |
<p>According to an aspect of the present invention, it is a deposition apparatus. The deposition apparatus includes a vacuum chamber; a substrate mounting part which is located in the vacuum chamber, supports the substrate to be vertical to the ground of the substrate, and moves the substrate up and down; and a first linear deposition source which faces the substrate and includes a first linear nozzle pipe which injects a first deposition particle to the substrate.</p> |
