| 摘要 |
<p>The present invention includes: a flexible substrate which includes at least one via and a via hole in order to connect circuit wiring which is respectively formed on the front and rear sides of the substrate; a wiring layer which is patterned and respectively formed by a printing method of a conductive paste composite along the pattern of the predetermined circuit wiring on the front and rear sides of the flexible substrate; an electroless metal plating layer which is formed on each patterned wiring layer; and each metal plating layer which is additionally formed on the electroless metal plating layer in order to improve the conductivity of wiring which is formed with the patterned wiring layer and the electroless metal plating layer on the front and rear sides of the flexible substrate. In the double-sided flexible printed circuit board and the manufacturing method thereof, each circuit wiring which is patterned on the front and rear sides of the flexible substrate is electrically connected with each other through the via which is formed in the via hole.</p> |
