| 摘要 |
The present invention is to provide a dicing tape-attached die bonding film which prevents the voids at the boundary of an object and a die bonding film after a sealing process even though in a long-term heating process at high temperature and also prevents the generation of crack, breakage, and pieces in a film even in cold transport and storage. The present invention includes a dicing tape and a die bonding film. The die bonding film contains thermosetting plastics (a), and thermosetting plastics (b) which has a viscosity of 0.1 to 50Pa·sec at 25°C. The thermosetting plastics (b) is at least one selected among groups consisting of epoxy resin and phenol resin. The content of the thermosetting plastics (b) in the entire resin is 1 wt% to 50 wt% and has storage modulus of 0.02 MPa or more at 260°C after being heated at 170°C for an hour. |
