| 摘要 |
<p>[Problem] To provide a circuit board capable of minimizing insulation breakdown between circuit members, having superior heat dissipation characteristics, and in which the circuit members are firmly bonded to a support substrate, and an electronic device having an electronic component mounted on the circuit member on the circuit board. [Solution] A circuit board (10) has multiple circuit members (2) bonded and arranged via a first bonding layer (3) on a first principal surface of a support substrate (1) comprised of a ceramic sintered compact. A projection (1a) is provided in an area for arranging the circuit member and an area between the circuit members on the first principal surface. The average height of the projection (1a1) provided in the area between the circuit members is lower than the average height of the projection (1a2) provided in the area for arranging the circuit member.</p> |
