| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic components efficiently by dividing a mother block into individual chips and reliably forming a plurality of aggregation divided block having a holding member that holds the chips in multiple number in a prescribed unit. <P>SOLUTION: A plurality of aggregation divided blocks 10b are formed as follows: holding a mother block 10 on an adhesive face of a first holding member of a composite member 20, the composite member 20 having a first holding member 1 including an adhesive face 1a for holding the mother block 10 to be pasted on an adhesive face 2a of a second holding member 2; performing a first cut process for penetrating the mother block to be cut at a depth halfway through the first holding member before reaching the second holding member in thickness direction; and performing a second cut process for penetrating the mother block and the first holding member to be cut at a depth on halfway through the second holding member in the thickness direction to form a plurality of aggregation divided blocks 10b in which the mother block is divided into a plurality of chips 10a and the chips are integrally held by the first holding member in a prescribed unit. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
