| 摘要 |
<p>The present invention relates to a flexible circuit board with a planarization cover layer structure. An insulation layer is included on the planarization cover layer to be combined with each surface of conductive signal lines disposed on the base of the flexible circuit board through a first adhesive layer of the flexible circuit board. A separation area formed between two adjacent lines of the conductive signal lines, respectively, is formed as a filling layer. The filling layer supplies a planarization height to the first adhesive layer, wherein the planarization height is the same as the height of the conductive signal lines. The first adhesive layer has the planarization height in the separation area and the planarization height is the sum of the conductive signal lines height and the cover height since the height of the filing layer is higher than the surface of a conductive layer as the cover height.</p> |
