| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method capable of easily and collectively manufacturing a plurality of electronic components in a short time with a good utilization efficiency of a material and little fracture on a side face of the electronic component because there is no portion which cannot be used for the electronic component. <P>SOLUTION: A first metallic or resin sacrificial layer 2 is formed on a form substrate 1, and a resist pattern 3 is formed on the first sacrificial layer 2. A second metallic or resin sacrificial layer 4 is formed at a portion, in which there is no resist pattern 3 on the first sacrificial layer 2. The resist pattern 3 is removed, so that a form 5 with a plurality of spaces 5a with the same shape and the same size as an outer shape of an electronic component 8 to be manufactured. An insulating base 6 is formed in the spaces 5a of the form 5, and an electronic component structure 7 is formed on the base 6, so as to form the electronic components 8 in the spaces 5a, respectively. By dissolving the first sacrificial layer 2 and the second sacrificial layer 4 constituting the form 5, the form 5 is removed, so as to obtain a plurality of electronic components 8. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
