发明名称 |
Hybrid memory blade |
摘要 |
The present invention is directed to server systems and methods thereof. More specifically, embodiments of the present invention provides a memory controller within a server system, where the memory controller is disengageably connected to one or more processors, a plurality of volatile memory modules, and plurality of solid-state memory modules. This memory controller may be connected to other similarly configured memory controllers. The volatile and solid-state memory modules can be removed and/or replaced. There are other embodiments as well. |
申请公布号 |
US8949473(B1) |
申请公布日期 |
2015.02.03 |
申请号 |
US201313768986 |
申请日期 |
2013.02.15 |
申请人 |
Inphi Corporation |
发明人 |
Haywood Christopher;Xu Chao;Tamer Fouad G. |
分类号 |
G06F3/00;G06F13/00;H05K7/14;G11C8/00 |
主分类号 |
G06F3/00 |
代理机构 |
Ogawa P.C. |
代理人 |
Ogawa Richard T.;Ogawa P.C. |
主权项 |
1. A server system comprising:
an enclosure having a plurality of mounting interfaces for a plurality of servers; a first blade housing structure configured with a length of no more than 900 mm and a width of no more than 500 mm, the first blade housing structure is disengageably coupled to at least one of the mounting interfaces; a first memory controller module comprising a first processor interface, a plurality of volatile memory interface, a plurality of solid-state memory interfaces, and a plurality of cascade interfaces, the first memory controller being disengageably mounted on the first blade housing structure; a first processor disengageably mounted to a first mounting interface of the enclosure, the processor being connected to the memory controller via the first processor interface; a plurality of volatile memory modules disengageably mounted to a plurality of memory mounting interfaces of the first blade housing structure; a plurality of solid-state memory modules disengageably mounted to a plurality of memory solid state interfaces of the first blade housing structure; a power management system positioned with the enclosure; a network interface positioned within the enclosure; and a thermal management system positioned within the enclosure; further comprising a plurality of blade housings for memory blade servers, wherein the first blade structure comprises a hybrid memory blade server. |
地址 |
Santa Clara CA US |