| 主权项 |
1. A photosensitive resin composition comprising: (a) an alkali-soluble polyimide which has a structural unit represented by general formula (1), while having a structure represented by general formula (2) and/or (3) at least one end of the main chain; (b) at least one compound selected from a bisphenol A-type epoxy compound, a novolac-type epoxy compound, a biphenyl-type epoxy compound and a glycidyl amine-type epoxy compound; and (c) a quinonediazide compound, wherein the content of the compound (b) is not less than 20 parts by weight per 100 parts by weight of the polyimide (a) wherein X is derived from a primary monoamine which is an end capping agent and represents a monovalent organic group having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, and Y is derived from a dicarboxylic anhydride which is an end capping agent and represents a divalent organic group having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group; and wherein R1 represents a tetra- to tetradeca-valent organic group, R2 represents a di- to dodeca-valent organic group, and R3 and R4 each independently represents at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, α and β each independently represents an integer of 0 to 10. |
