发明名称 Cards and devices with embedded holograms
摘要 A card, such as a payment card, or other device may include an electronics package. The electronics package may include electronic components mounted on a flexible, printed circuit board. The electronics package may be laminated (e.g., via a hot, cold, or molding lamination process) between layers of transparent polymer. A hologram may be fixed to one side of the electronics package such that the hologram may be viewed from the exterior of the laminated card having transparent polymer layers. As such, the hologram may not be removed without breaching the integrity of a transparent polymer layer.
申请公布号 US8944333(B1) 申请公布日期 2015.02.03
申请号 US201314030712 申请日期 2013.09.18
申请人 Dynamics Inc. 发明人 Mullen Jeffrey D.;Nicklaus Eric R.
分类号 G06K15/00;G03H1/04;G06K15/12 主分类号 G06K15/00
代理机构 代理人
主权项 1. A method comprising: affixing a hologram to a hologram region of a card layer; and printing a first material layer on the card layer such that at least a first portion of the hologram region does not include the first material layer.
地址 Pittsburgh PA US