发明名称 Electrically conductive laminate structure containing graphene region
摘要 Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions.
申请公布号 US8946903(B2) 申请公布日期 2015.02.03
申请号 US201012833074 申请日期 2010.07.09
申请人 Micron Technology, Inc. 发明人 Sandhu Gurtej S.
分类号 H01L23/48;H01L23/52;H01L29/40;H01B13/00;H01L21/768;H01L23/532 主分类号 H01L23/48
代理机构 Wells St. John P.S. 代理人 Wells St. John P.S.
主权项 1. An electrically conductive laminate structure comprising: a first non-graphene layer configured as an upwardly-opening first container shape, the first non-graphene layer being electrically conductive and continuous along the first container shape; at least one graphene monolayer within the first container shape and directly against the first non-graphene layer, the graphene monolayer being configured as an upwardly-opening second container shape; and a second non-graphene layer within the second container shape and directly against the graphene monolayer, the second non-graphene layer being electrically insulative and continuous along the first container shape.
地址 Boise ID US