Microelectronic package and method of manufacture thereof

摘要

A microelectronic assembly may include a substrate having an opening extending between first and second oppositely facing surfaces of the substrate, the opening elongated in a first direction; and at least one microelectronic element having a front face facing and attached to the first surface of the substrate and a plurality of contacts at the front face overlying the opening, the microelectronic element having first and second opposite peripheral edges extending away from the front face. The first peripheral edge extends beyond, or is aligned in the first direction with, an inner edge of the opening, and the opening extends beyond the second peripheral edge.

主权项

1. A microelectronic assembly comprising:
a substrate having an opening extending between first and second oppositely facing surfaces of the substrate, the opening elongated in a first direction; and a microelectronic element having a front face facing and attached to the first surface of the substrate and a plurality of contacts at the front face overlying the opening, the microelectronic element having first and second opposite peripheral edges extending away from the front face, wherein the opening extends beyond at least one of the first or second peripheral edges, wherein at least one of the first surface or the second surface of the substrate partially defines at least one vent extending from the opening.