| 摘要 |
<p>A resin composition, containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), and characterized by the inorganic filler being surface treated using a specified organic compound. This resin composition: has a low arithmetic average roughness and root-mean-square roughness on an insulating layer surface in a wet roughening step; is capable of forming a plated conductive layer having sufficient peel strength on the insulating layer; and has PCT resistance.</p> |
