| 摘要 |
The present invention relates to a TO can type high-speed optical communication module including a laser diode chip which is used for the high-speed communication faster than 5 Gbps. The high-speed optical communication module includes a high-speed signal transmission substrate (200) which is used to transmit signals to the laser diode chip (100). The high-speed signal transmission substrate includes an upper high-speed signal transmission substrate (210) with a high-speed signal transmission path pattern and a lower high-speed signal transmission substrate (220) which an upper conductive surface. The present invention enables high-speed communication through the high-speed signal transmission substrate single-ended impedance 25 ohm or 50 ohm termination impedance. The height of the substrate mounted with the laser diode chip for the high-speed communication is 0.4 mm to enable easy optical coupling between the laser diode chip and the lens. The high-speed transmission path is implemented to have the substrate width of 0.6 mm or less to be effectively mounted in a package with a narrow TO can type package. |
