Low profile wire bonded USB device

摘要

A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

主权项

1. A USB flash memory device, comprising:
a substrate; a conductance pattern defined on a surface of the substrate; USB connector pins formed in the conductance pattern on the substrate for removable insertion into a host device and for electrically coupling the USB flash memory device with the host device when inserted into the host device; one or more semiconductor die, the one or more semiconductor die including die bond pads on an upper surface of the one or more semiconductor die; wire bonds formed between the die bond pads on the one or more semiconductor die and the substrate; molding compound encapsulating the one or more semiconductor die and wire bonds.