Method and apparatus for image sensor packaging

摘要

A backside illuminated image sensor having a photodiode and a first transistor in a sensor region and located in a first substrate, with the first transistor electrically coupled to the photodiode. The image sensor has logic circuits formed in a second substrate. The second substrate is stacked on the first substrate and the logic circuits are coupled to the first transistor through bonding pads, the bonding pads disposed outside of the sensor region.

主权项

1. A device comprising:
a sensor die comprising
a sensor region;a plurality of pixels disposed within the sensor region; anda plurality of sensor bond pads disposed outside the sensor region, each of the plurality of sensor bond pads having a surface exposed through a front side of the sensor die; and a control circuit die comprising:
at least one sensor control circuit; anda plurality of control circuit bond pads, each of the plurality of control circuit bond pads bonded to at least one of the plurality of sensor bond pads.