发明名称 |
Method for packaging light emitting diodes and light emitting module having LED packages formed by the method |
摘要 |
A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process. |
申请公布号 |
US8946734(B2) |
申请公布日期 |
2015.02.03 |
申请号 |
US201213457553 |
申请日期 |
2012.04.27 |
申请人 |
Advanced Optoelectronic Technology, Inc. |
发明人 |
Lo Hsing-Fen |
分类号 |
H01L33/08;H01L33/44;H01L33/52;H01L25/075 |
主分类号 |
H01L33/08 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. A method for making a light emitting module, comprising steps of:
a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other and each electrode striding over two neighboring rigid portions; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate to obtain the light emitting module which includes at least two rigid portions and at least two LED dies over the at least two rigid portions, wherein at least one of above steps b, c, d is performed by a roll applying process. |
地址 |
Hsinchu Hsien TW |