发明名称 Method for producing metal thin film
摘要 A method for producing a metal thin film on a substrate includes: a step of applying an ink to a flat blanket; a first transfer step of bringing the first blanket and a letterpress having a predetermined pattern of projections into contact by a pressure compression while the flat blanked and the letterpress being disposed opposite each other, to selectively transfer a portion of the ink on the flat blanket corresponding to the projections to the letterpress; a second transfer step of bringing the flat blanket obtained after the first transfer step and the substrate into contact by pressure compression while the flat blanket and the substrate being disposed opposite each other, to transfer the ink remaining on the flat blanket to the substrate; and a step of subjecting the substrate obtained after the second transfer step to electroless plating to deposit a metal thin film on the substrate.
申请公布号 US8943963(B2) 申请公布日期 2015.02.03
申请号 US201113233581 申请日期 2011.09.15
申请人 Sony Corporation 发明人 Tanaka Masanobu;Ishihara Hirotsugu;Shimamura Toshiki;Kamei Takahiro
分类号 B41F1/00;B41F17/00 主分类号 B41F1/00
代理机构 Wolf, Greenfield & Sacks, P.C. 代理人 Wolf, Greenfield & Sacks, P.C.
主权项 1. A transfer apparatus for producing a thin film pattern on a substrate, the transfer apparatus comprising: a first stage; a flat blanket fixed to the first stage, the flat blanket comprising a flexible layer and a rigid base, the rigid base rigidly supporting the flexible layer, wherein the rigid base has a thickness of about 10 to 500 microns and the flexible layer has a thickness of 1 to 5000 microns; an ink disposed on a surface of the flat blanket; a second stage located opposite the first stage; a letterpress fixed to the second stage; a fixation portion to fix the outer edge of the flat blanket on the first stage; wherein the first stage includes an opening adapted for compressed air-injection toward the flat blanket for pushing the flat blanket against the letterpress.
地址 Tokyo JP