| 发明名称 | Methods for manufacturing light emitting diode and light emitting device | ||
| 摘要 | The present invention provides manufacturing methods of an LED and a light emitting device. The manufacturing method of the LED includes: providing a substrate; forming on the substrate an LED chip and a second electrode successively; forming a lens structure covering the second electrode; coating the lens structure with fluorescent powder; forming a plurality of evenly distributed contact holes on a backface of the substrate, the contact holes extending through the substrate and to the LED chip; and filling the contact holes with conducting material till the backface of the substrate is covered by the conducting material. The LED has a high luminous efficiency and the manufacturing method is easy to implement. | ||
| 申请公布号 | US8945958(B2) | 申请公布日期 | 2015.02.03 |
| 申请号 | US201414321061 | 申请日期 | 2014.07.01 |
| 申请人 | Enraytek Optoelectronics Co., Ltd. | 发明人 | Chang Richard Rugin |
| 分类号 | H01L21/00;H01L33/00 | 主分类号 | H01L21/00 |
| 代理机构 | Faegre Baker Daniels LLP | 代理人 | Faegre Baker Daniels LLP |
| 主权项 | 1. A method for manufacturing an LED comprising: providing a substrate; forming on the substrate an LED chip and a second electrode successively; forming a lens structure covering the second electrode; coating the lens structure with fluorescent powder; forming a plurality of evenly distributed contact holes on a backface of the substrate, the contact holes extending through the substrate and to the LED chip; and filling the contact holes with conducting material till the backface of the substrate is covered by the conducting material. | ||
| 地址 | Shanghai CN | ||