Light emitting diode package, method for manufacturing the same and light source unit having the LED package

摘要

Disclosed are a high efficiency LED package with reduced production costs, a method for manufacturing the same, and a light source unit having the LED package. The method for manufacturing the LED package includes preparing a mold frame on which an LED is mounted, forming a hemi-spherical lens having a reverse-conical top part and a lateral part with haze formed by sanding or bead treatment, and fixing the lens to the mold frame to enclose the LED.

主权项

1. A method for manufacturing an LED package, comprising:
preparing a mold frame on which an LED is mounted; forming a unitary hemi-spherical lens including a reverse-conical top central part injected between adjacent two half-circles and a lateral part being another portion except for a top part of the lens; and fixing the lens to the mold frame to enclose the LED, wherein a width of the lens is less than a width of the mold frame such that the entire lens is positioned on the mold frame, wherein haze is formed on only the entire lateral part by sanding to adhere scattered particles to an outer side of the lateral part of the lens or bead treatment, in order to prevent light of the LED from being emitted only in a vertical direction to enhance light diffusion efficiency, and wherein the LED is fixed inside of the mold frame and comprised of red phosphor, green phosphor, and a blue LED chip.