| 发明名称 | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics | ||
| 摘要 | A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic. | ||
| 申请公布号 | US8946333(B2) | 申请公布日期 | 2015.02.03 |
| 申请号 | US201313829225 | 申请日期 | 2013.03.14 |
| 申请人 | Momentive Performance Materials Inc. | 发明人 | Raman Chandrashekar;Xiang Bei;Murugaiah Anand |
| 分类号 | C08K3/38;C08K3/20;B32B19/04;C08K5/5425;C08K5/54;C08K3/22;C08K13/02;B29C47/64;C08J3/20;B29B7/42;B29B7/48;B29C47/38;B29C47/60;B29C47/00;B29B7/84;B29B7/90 | 主分类号 | C08K3/38 |
| 代理机构 | McDonald Hopkins LLC | 代理人 | Waters, Esq. Joseph E.;McDonald Hopkins LLC |
| 主权项 | 1. A filler composition comprising a blend of: a boron nitride; a metal oxide; and a silane, wherein the silane is chosen from a thiocarboxylate silane, a blocked mercapto silane, or a combination thereof. | ||
| 地址 | Waterford NY US | ||