发明名称 |
Packaged semiconductor device having multilevel leadframes configured as modules |
摘要 |
A semiconductor system (100) has a first planar leadframe (101) with first leads (102) and pads (103) having attached electronic components (120), the first leadframe including a set of elongated leads (104) bent at an angle away from the plane of the first leadframe; a second planar leadframe (110) with second leads (112) and pads (113) having attached electronic components (114); the bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes; and packaging material (140) encapsulating the 3-dimensional network. |
申请公布号 |
US8946880(B2) |
申请公布日期 |
2015.02.03 |
申请号 |
US201313848771 |
申请日期 |
2013.03.22 |
申请人 |
Texas Instruments Incorporated |
发明人 |
Saye Richard J. |
分类号 |
H01L23/02;H01L23/495;H01L21/56;H01L23/00;H01L23/31 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
Shaw Steven A.;Telecky, Jr. Frederick J. |
主权项 |
1. A modular system in package semiconductor device with a plurality of interconnect levels comprising:
a first pre-assembled modular subassembly comprising:
a planar leadframe with set of first leads;pads having attached electronic components; anda first set of elongated leads bent in a first direction away from the plane of the planar leadframe; a second planar leadframe with second set of leads and pads having attached electronic components; the bent leads of the first pre-assembled modular subassembly leadframe conductively connected to the second planar leadframe, forming a conductively linked 3-dimensional network between attached electronic components and sets of leads in two planes; and packaging material encapsulating portions of the 3-dimensional network. |
地址 |
Dallas TX US |