Method for gold removal from electronic components

摘要

In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.

主权项

1. A method for electronic component thermal shock management, the method comprising:
(a) automatically unloading a plurality of electronic components from an electronic component holder to individual solder pads adhered to a non-metallic substrate; (b) positioning the non-metallic substrate on a first moving mechanism; (c) moving the non-metallic substrate through a first oven via the first moving mechanism to heat and cool the plurality of electronic components based on a first temperature profile, wherein the heating of each of the solder pads forms a gold and solder mixture on each of the plurality of electronic components; (d) placing the plurality of electronic components on a metallic screen from the non-metallic substrate; (e) loading the metallic screen on a second moving mechanism; and (f) moving the metallic screen through a second oven via the second moving mechanism to heat and cool the plurality of electronic components based on a second temperature profile, wherein the heating of each of the electronic components wicks part or all of the gold and solder mixture to the metallic screen.