发明名称 Apparatus to interconnect orthogonal circuit boards for high data rate use
摘要 A method includes securing a midplane in a chassis, wherein the midplane has one or more connectors, and securing a circuit board in a module, wherein the circuit board has one or more connectors secured along a leading edge of the circuit board for selectively connecting with the one or more connector on the midplane. The method further includes positioning the module so that the circuit board within the module is orthogonal to the midplane, and manually actuating a handle from an unlatched position to a latched position to rotate a cam plate and cause a cam surface of the cam plate to pull the circuit board toward the midplane and connect the one or more connector on the circuit board with the one or more connector on the midplane.
申请公布号 US8944832(B1) 申请公布日期 2015.02.03
申请号 US201314016356 申请日期 2013.09.03
申请人 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. 发明人 Kerrigan Brian M.;Lindsay Robert M.
分类号 H01R13/62;H01R43/20;H01R43/26 主分类号 H01R13/62
代理机构 代理人 Brown Katherine S.;Streets Jeffrey L.
主权项 1. A method, comprising: securing a midplane in a chassis, wherein the midplane has one or more connectors; securing a circuit board in a module, wherein the circuit board has one or more connectors secured along a leading edge of the circuit board for selectively connecting with the one or more connectors on the midplane; positioning the module so that the circuit board within the module is orthogonal to the midplane; and manually actuating a handle from the unlatched position to the latched position to rotate a cam plate and cause a cam surface of the cam plate to pull the circuit board toward the midplane and connect the one or more connectors on the circuit board with the one or more connectors on the midplane.
地址 Singapore SG