Lithographic apparatus and method

摘要

In a lithographic apparatus, a slip of a patterning device relative to a support, the support constructed to support the patterning device, may be provided by measuring a position of the support relative to a first structure of the lithographic apparatus; measuring a position of the patterning device relative to a second structure of the lithographic apparatus; determining a correlation between the position of the patterning device and the position of the support from the measured position of the support, the measured position of the patterning device, and the mutual positions of the first and second structures; and deriving from the correlation a slip of the patterning device relative to the support. The structure may include a projection system to project a radiation beam patterned by the patterning device. The projection system may be connected to a frame, such as a metrology frame of the lithographic apparatus.

主权项

1. A lithographic apparatus comprising:
an illumination system configured to condition a radiation beam; a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate; a projection system configured to project the patterned radiation beam onto a target portion of the substrate; a support position sensor to measure a position of the support relative to a first structure of the lithographic apparatus; a patterning device position sensor located at a second structure of the lithographic apparatus to measure a position of the patterning device relative to the second structure, wherein the second structure is not connected to the first structure; and a control device configured to determine a correlation between a first component of the position of the patterning device and a second component of the position of the support from the position measured by the support position sensor, the position measured by the patterning device position sensor, and mutual positions of the first and second structures, wherein the first and second components are taken along a coordinate axis fixed relative to the first and second structures.