Packaging substrate having embedded through-via interposer and method of fabricating the same

摘要

A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with first end surfaces of the conductive through-vias, and a built-up structure formed on the encapsulant layer and the through-via interposer for electrically connecting second end surfaces of the conductive through-vias. As such, the first end surfaces of the conductive through-vias are electrically connected to the redistribution layer to thereby be electrically connected to electrode pads of a semiconductor chip having smaller pitches, while the second end surfaces of the conductive through-vias electrically connect with conductive vias of the built-up structure having larger pitches, thereby allowing the packaging substrate to be coupled with the semiconductor chip.

主权项

1. A packaging substrate having an embedded through-via interposer, comprising:
an encapsulant layer having opposite first and second surfaces; a through-via interposer embedded in the encapsulant layer and having opposite first and second sides and a plurality of conductive through-vias in communication with the first and second sides, wherein each of the conductive through-vias has a first end surface on the first side of the through-via interposer and a second end surface on the second side of the through-via interposer, the second side of the through-via interposer is exposed from the second surface of the encapsulant layer, the second side of the through-via interposer is flush with the second surface of the encapsulant, and the second end surfaces of the conductive through-vias protrude above the second side of the through-via interposer and the second surface of the encapsulant layer to serve as conductive bumps; a redistribution layer embedded in the encapsulant layer and formed on the first side of the through-via interposer and the first end surfaces of the conductive through-vias so as to electrically connect with the first end surfaces of the conductive through-vias, wherein the outermost layer of the redistribution layer has electrode pads; and a built-up structure formed on the second surface of the encapsulant layer, the second side of the through-via interposer and the conductive bumps, and having at least a dielectric layer, a circuit layer formed on the dielectric layer and a plurality of conductive vias formed in the dielectric layer for electrically connecting with the circuit layer, wherein portions of the conductive vias electrically connect with the conductive bumps, respectively.