发明名称 Method of forming transistors with ultra-short gate feature
摘要 A semiconductor transistor is formed as follows. A gate electrode is formed over but is insulated from a semiconductor body region. A first layer of insulating material is formed over the gate electrode and the semiconductor body region. A second layer of insulating material different from the first layer of insulating material is formed over the first layer of insulating material. Only the second layer of insulating material is etched to form spacers along the side-walls of the gate electrode. Impurities are implanted through the first layer of insulating material to form a source region and a drain region in the body region. A substantial portion of those portions of the first layer of insulting material extending over the source and drain regions is removed.
申请公布号 US8946003(B2) 申请公布日期 2015.02.03
申请号 US200711676777 申请日期 2007.02.20
申请人 SK hynix Inc. 发明人 Rabkin Peter;Wang Hsingya Arthur;Chou Kai-Cheng
分类号 H01L21/8232;H01L21/8234;H01L27/115;H01L27/105;H01L29/423 主分类号 H01L21/8232
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A method of forming semiconductor transistors, comprising: forming first and second gate electrodes over but insulated from a semiconductor body region; forming off-set spacers along side-walls of the first and second gate electrodes; after forming the off-set spacers, performing a DDD implant to form DDD source and drain regions in the semiconductor body region adjacent the first gate electrode; after forming the off-set spacers, performing an LDD implant to form LDD source and drain regions in the semiconductor region adjacent the second gate electrode; forming main spacers along the off-set spacers of the first and second gate electrodes; and after forming the main spacers, performing a first source/drain (S/D) implant to form highly doped first source and first drain regions in the respective DDD and LDD source and drain regions such that the DDD and LDD source and drain regions each extend into the semiconductor body region to a greater depth than the greatest depth of the highly doped first source and first drain regions, wherein the highly doped first source and first drain regions have the same conductivity type as but greater doping concentration than the DDD and LDD source and drain regions.
地址 Icheon-si KR