| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric conversion element with the reliability enhanced by enhancing adhesion of copper deposited by electrolytic plating and a transparent conductive layer, thereby reducing reaction of a translucent insulation layer and copper; and to provide a manufacturing method for raising the productivity by enhancing the plating growth rate.SOLUTION: A photoelectric conversion element has a p-type or n-type semiconductor on any surface of a single crystal silicon substrate, with a transparent conductive layer electrode being formed on the semiconductor, and includes a translucent insulation layer and copper wiring on the transparent conductive layer. The photoelectric conversion element has chemical elements composing the transparent conductive layer between the translucent insulation layer and copper wiring, and between the transparent conductive layer and copper wiring, and has a barrier film having oxygen concentration lower than that of the transparent conductive layer. As a result, adhesion of the transparent conductive layer and copper wiring is enhanced, and a plating growth rate increases. Thereby the reliability of a product is enhanced. |
