发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the performance of a semiconductor device.SOLUTION: A method of manufacturing a semiconductor device comprises the steps of: forming a p-type well PW1, used for a photo diode PD, within a semiconductor substrate SB; forming an n-type semiconductor region NW, used for the photo diode PD, within the semiconductor substrate SB so as to be included in the p-type well PW1; and forming a ptype semiconductor region PR in a surface layer portion of the n-type semiconductor region NW. The ptype semiconductor region PR is formed by ion-implanting a cluster composed of multiple boron and hydrogen atoms.
申请公布号 JP2015023150(A) 申请公布日期 2015.02.02
申请号 JP20130150106 申请日期 2013.07.19
申请人 RENESAS ELECTRONICS CORP 发明人 YAMAGUCHI SUNAO
分类号 H01L27/146;H01L21/265;H01L31/10 主分类号 H01L27/146
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